Influence of Different Etching Modes on Bond Strength to Enamel using Universal Adhesive Systems

JOURNAL TITLE: The Journal of Contemporary Dental Practice

Author
1. Carlos RG Torres
2. Shelon CS Pinto
3. Rudys R De Jesus Tavarez
4. Leily M Firoozmand
5. Mateus R Tonetto
6. Ana CS Diniz
7. Larissa M Pinheiro
8. Lauber J dos Santosh Almeida
ISSN
DOI
10.5005/jp-journals-10024-1937
Volume
17
Issue
10
Publishing Year
2016
Pages
6
Author Affiliations
    1. Professor, 3,4Student
    1. Department of Post-Graduate Program in Dentistry, CEUMA University, Renascença, São Luís, Brazil
    1. Department of Dentistry, Federal University of Maranhão (UFMA), São Luís, Brazil
    1. Department of Dentistry, Federal University of Maranhão (UFMA), São Luís, Brazil
    1. Department of Restorative Dentistry, Institute of Science and Technology of São José dos Campos – São Paulo State University – UNESP, São José dos Campos, Brazil
    1. Department of Dentistry, State University of Ponta Grossa Ponta Grossa, Brazil
    1. Department of Post-Graduate Program in Dentistry, CEUMA University, Renascença, São Luís, Brazil
    1. Department of Dentistry, Federal University of Maranhão (UFMA), São Luís, Brazil
  • Article keywords

    Abstract

    Introduction

    The adhesive systems and the techniques currently used are designed to provide a more effective adhesion with reduction of the protocol application. The objective of this study was to evaluate the bond strength of universal adhesive systems on enamel in different etching modes (self-etch and total etch).

    Materials and methods

    The mesial and distal halves of 52 bovine incisors, healthy, freshly extracted, were used and divided into seven experimental groups (n = 13). The enamel was treated in accordance with the following experimental conditions: FUE-Universal System – Futurabond U (VOCO) with etching; FUWE – Futurabond U (VOCO) without etching; SB-Total Etch System – Single Bond 2 (3M); SBUE-Universal System – Single Bond Universal (3M ESPE) with etching; SBUWE – Single Bond Universal (3M ESPE) without etching; CLE-Self-etch System – Clearfil SE Bond (Kuraray) was applied with etching; CLWE – Clearfil SE Bond (Kuraray) without etching. The specimens were made using the composite spectrum TPH (Dentsply) and stored in distilled water (37 ± 1°C) for 1 month. The microshear test was performed using the universal testing machine EMIC DL 2000 with the crosshead speed of 0.5 mm/minute. The bond strength values were analyzed using statistical tests (Kruskal–Wallis test and Mann–Whitney test) with Bonferroni correction.

    Results

    There was no statistically significant difference between groups (p < 0.05), where FUE (36.83 ± 4.9 MPa) showed the highest bond strength values and SBUWE (18.40 ± 2.2 MPa) showed the lowest bond strength values. The analysis of adhesive interface revealed that most failures occurred between the interface composite resin and adhesive.

    Conclusion

    The universal adhesive system used in dental enamel varies according to the trademark, and the previous enamel etching for universal systems and the self-etch both induced greater bond strength values.

    Clinical significance

    Selective enamel etching prior to the application of a universal adhesive system is a relevant strategy for better performance bonding.

    How to cite this article

    Diniz ACS, Bandeca MC, Pinheiro LM, dos Santos Almeida LJr, Torres CRG, Borges AH, Pinto SCS, Tonetto MR, De Jesus Tavarez RR, Firoozmand LM. Influence of Different Etching Modes on Bond Strength to Enamel using Universal Adhesive Systems. J Contemp Dent Pract 2016;17(10):820-825.

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